bumped gaas sp3t switch for wlan 2.4 - 2.5 ghz rev. v4 masw-008902-000die 1 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. features ? 802.11b/g and bluetooth applications ? insertion loss: 0.60 db typical ? isolation: 31 db typical (r x path) 22 db typical (t x / bt paths) ? flip-chip configuration ? rohs* compliant description the masw-008902-000die is a bumped single band gaas phemt mmic sp3t switch. typical applications are for single band 2.4 ghz wlan (802.11 b/g) and bluetooth applications. the masw-008902-000die delivers high isolation, low insertion loss, and high linearity at 2.4 - 2.5 ghz. the masw-008902-000die is fabricated using a 0.5 micron gate length gaas phemt process. the process features full passivation for performance and reliability. this die features snag (2.5%) solder bumps for wlcsp applications. * restrictions on hazardous substances , european union directive 2002/95/ec. ordering information 1,2 part number package masw-008902-000die separated die on grip ring masw-008902-000d3k die in 3000 piece reel masw-008902-001smb sample board sp3t 1. die quantity varies. 2. die on grip ring not available with orientation mark. die bump pad layout (bump side up) die bump pad configuration parameter absolute maximum input power @ 3 v control +32 dbm input power @ 5 v control +35 dbm operating voltage +8 volts operating temperature -40c to +85c storage temperature -65c to +150c absolute maximum ratings 3,4 3. exceeding any one or combination of these limits may cause permanent damage to this device. 4. m/a-com technology does not recommend sustained operation near these su rvivability limits. name description v c 1 voltage control 1 bt blue tooth t x /r x port gnd ground t x 2.5 ghz t x port v c 3 voltage control 3 r x 2.5 ghz r x port v c 2 voltage control 2 rfc antenna port
bumped gaas sp3t switch for wlan 2.4 - 2.5 ghz rev. v4 masw-008902-000die 2 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. parameter test conditions units min. typ. max. insertion loss rfc to t x /r x /bt, 2.4 ghz db ? 0.60 0.75 isolation rfc to t x , 2.4 ghz rfc to r x , 2.4 ghz rfc to bt, 2.4 ghz db 20 30 20 23.5 31.0 21.0 ? ? ? return loss 2.4 - 2.5 ghz db ? 15 ? ip3 rf to t x /r x /bt, 2.4 ghz, 20 dbm total power, 1 mhz spacing dbm ? 55 ? input p1db rf to t x , 2.4 - 2.5 ghz rf to r x, 2.4 - 2.5 ghz rf to bt, 2.4 - 2.5 ghz dbm ? ? ? 32 28 32 ? ? ? harmonics rf to t x , 2.4 - 2.5 ghz, 20 dbm dbm ? -75 ? control current |v c | = 3 v a ? <1 10 switching speed 50% control to 90% rf 50% control to 10% rf ns ? ? 165 25 ? ? 5. external blocking capacitors on all rf ports. electrical specifications 5 : t a = 25c, z 0 = 50 ? , v c = 0/3v, p in = 0 dbm 6. for positive voltage control, external dc blocking capacitors are required on all rf ports. 7. differential voltage, v(state 1) - v(state 0), must be +2.7 v minimum and must not exceed +5 v. 8. 0 = 0 0.3 v, 1 = +2.7 v to +5 v. v c 1 v c 2 v c 3 rfc?bt rfc-t x rfc-r x 1 0 0 on off off 0 1 0 off on off 0 0 1 off off on handling procedures please observe the following precautions to avoid damage: static sensitivity gallium arsenide integrated circuits are sensitive to electrostatic discharge (esd) and can be damaged by static electricity. proper esd control techniques should be used when handling these devices. parts list part value case style c1 - c4 39 pf 0402 c5 - c7 1000 pf 0402 recommended pcb configuration truth table 6,7,8
bumped gaas sp3t switch for wlan 2.4 - 2.5 ghz rev. v4 masw-008902-000die 3 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. 0.7 0.6 0.5 0.4 0.3 0.2 0.1 -0 .0 lb usl lb 0 target * usl 0.75 s am ple m ean 0.589937 process data ppk 0.82 o v e ra ll c a p a b ility process capability insertion loss - all paths (db) 1.8 1.5 1.2 0.9 0.6 0.3 0.0 lb usl lb 0 target * usl 2 s am ple m ean 0.353655 p rocess d ata ppk 2.33 o v e ra ll c a p a b ility process capability s w itc h c u rre n t - a ll p a th s (u a ) 38 37 36 35 34 33 32 31 30 29 28 ls l ls l 3 0 target * s am ple m ean 31.2276 p rocess d ata ppk 0.87 o v e ra ll c a p a b ility process capability rx isolation (db) product consistency distribution charts 9 (on wafer rf test) 28 27 26 25 24 23 22 21 20 19 18 ls l ls l 20 target * sample mean 23.5157 p rocess d ata ppk 3.99 o v e ra ll c a p a b ility process capability tx isolation (db) 23 22 21 20 19 18 lsl ls l 20 target * sample mean 21.2414 process data ppk 1.73 o v erall c apability process capability bluetooth isolation (db) process capability 9. represents >50 wafers, tested per electr ical specifications: freq. = 2.4 ghz, t a = 25c, z 0 = 50 ? , v c = 0/3v, p in = 0 dbm
bumped gaas sp3t switch for wlan 2.4 - 2.5 ghz rev. v4 masw-008902-000die 4 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. r x insertion loss t x insertion loss t x isolation r x isolation typical performance curves (plots = chip on board assembly) bt insertion loss bt isolation 0.65 0.70 0.75 0.80 0.85 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 0.65 0.70 0.75 0.80 0.85 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 0.65 0.70 0.75 0.80 0.85 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz) 15 20 25 30 35 2.40 2.42 2.44 2.46 2.48 2.50 +25c -40c +85c frequency (ghz)
bumped gaas sp3t switch for wlan 2.4 - 2.5 ghz rev. v4 masw-008902-000die 5 ? north america tel: 800.366.2266 ? europe tel: +353.21.244.6400 ? india tel: +91.80.43537383 ? china tel: +86.21.2407.1588 visit www.macomtech.com for addi tional data sheets and product information. m/a-com technology solutions inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. advanced: data sheets contain information regarding a product m/a-com technology solutions is considering for development. performance is based on target specifications, simulated results, and/or prototype measurements. commitment to develop is not guaranteed. preliminary: data sheets contain information regarding a product m/a-com technology solutions has under development. performance is based on engineering tests. specifications are typical. mechanical outline has been fixed. engineering samples and/or test data may be available. commitment to produce in volume is not guaranteed. die dimensions (top and side vi ews) pcb top metal / solder mask die bump pad layout - bottom view (bump side down - as installed on board) die bump pad layout - top view (bump side up) 10.orientation mark is only on mate rial that is shipped in tape and reel. the mark is not avail able on die shipped on grip ring.
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